Power & Energy
Power semiconductors and analog devices are pivotal in energy supply, transmission, and use. Surpassing Moore’s Law limits requires application-driven diversification and integration, with packaging as the enabler.
In power & energy applications, JCET develops AIGC and Communication base station power modules in close partnership with leading customers. We’re expanding capacity for mid-to-high-power devices and modules, extending Kelvin packaging formats (TOLL, TO-263-7, TO-247-4), pioneering bottom, top, and dual-sided cooling structures, and applying silver sintering and DBC processes.
Product & Package Form添加分类
AIGC Power Modules
DrMOS, Multiphase Controller, PoL, IBC
WLP
FC QFN
Cu Clip QFN
FC LGA
Module Assembly
SiC / GaN Devices
SiC/GaN MOSFET, SiC Diode, Power Module, …
TOLT
TOLL
TO263-7L
TO247-4L
TO-247Plus-4L
Power Module
Silicon-Based Analog Devices
PMIC, Isolator, Gate Driver, Amplifier, Regulator, …
SOP16 (550mil)
SMP8
HTSSOP
fcQFN
WB-MCM
HFBP
Highlights
Ultra-precision power-module manufacturing and comprehensive AIGC power-system solutions
End-to-end wide bandgap semiconductor solutions and diverse packaging—from wafer processes to products
Si PMIC & power-system solutions providing ~3,000 package types, WLCSP, and SiP customization.
Extensive expertise in wafer processing, advanced architectures, high-temperature materials, and thermal diffusion.
More Applications
